Rapide II™ Hi-Speed Interconnect Architecture Solutions

Overview of our innovative interconnect solutions supporting the industry’s advanced communication including PCIe Gen4/Gen5 and SAS 3.0/4.0 in both the industry’s standard & proprietary high-density form factors.

  • Capability: Form Factors Varieties, Custom Lengths, Fast Turnaround as short as 3+ weeks
  • Flexibility: Mix and Match, Color Sleeving (Black, Blue, Green, Red), LSZH Cable Materials
Rapide II™ Hi-Speed Interconnect Architecture Solutions